Particle-free, residue-free laser cleaning for semiconductor, electronics, and medical device surfaces. No media, no solvents, and no fibers introduced into controlled environments.
Clean room and medical device manufacturing run under strict particle and residue limits. Sandblasting introduces media particles, solvent cleaning leaves chemical residue, and wipes shed fibers. Any of these fails a particle count or a cleanliness validation.
Semiconductor tooling, electronics assemblies, and medical device components carry oxide, flux, and process residue that must come off without abrasion or chemistry. Manual methods scratch precision surfaces and risk electrostatic damage.
Laser cleaning removes the contaminant with no media, no solvent, and no contact. The vaporized residue is captured by HEPA filtration. The surface is ready for the next process step or for cleanliness validation.
Applications
USE CASE 01
Medical Device Cleaning
Remove oxide, lubricant, and process residue from stainless and titanium device components. No abrasive media, no solvent residue, no fiber contamination.
USE CASE 02
Semiconductor Tooling
Strip deposition buildup and oxide from fixtures and chamber hardware without scratching precision surfaces or introducing particles.
USE CASE 03
Electronics and Connectors
Clean flux, oxide, and contamination from contacts and assemblies with low heat input and no electrostatic risk.
Laser cleaning introduces no media and no solvent, and the vaporized contaminant is captured by HEPA filtration. Your particle count and cleanliness validation confirm the result. We provide procedure documentation for your records.
No. The laser ablates the contaminant while the base material reflects the beam, with low heat input. Polished and precision surfaces keep their finish and tolerance, unlike abrasive methods.
Yes. Our equipment is mobile and the process is dry and contained. We coordinate with your environmental controls and document the cleaning for validation.